| Active Filters |
| | | | | | | | | | | | | |
| 214178 | - 2F6 - Other (please specify)
| - 2.E.4 - Heat Transfer Fluid
| | 2006 IPCC default | Emission Factor for Fluorinated Compound (FC) Emissions from Evaporation of Heat Transfer Fluids (2006 IPCC Guidelines Tier 1 default: See "Comments from data provider") | See "Comments from data provider". | | | | | 0.3 | kg C6F14/m^2 of silicon consumed | 2006 IPCC Guidelines for National Greenhouse Gas Inventories (Volume 3, Chapter 6, Table 6.2) | |
| 234186 | - 2E - Production of Halocarbons and Sulphur Hexafluoride
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
| | 2019 Refinement default | Tier 1 Gas-Specific Emission Factors For Process GHG Emissions From Electronics Manufacturing | | MEMS (micro-electromechanical systems) | | | | 0.015 | kg/m2 | 2019 Refinement | |
| 234187 | - 2E - Production of Halocarbons and Sulphur Hexafluoride
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
| | 2019 Refinement default | Tier 1 Gas-Specific Emission Factors For Process GHG Emissions From Electronics Manufacturing | | MEMS (micro-electromechanical systems) | | | | 0.076 | kg/m2 | 2019 Refinement | |
| 234188 | - 2E - Production of Halocarbons and Sulphur Hexafluoride
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
| | 2019 Refinement default | Tier 1 Gas-Specific Emission Factors For Process GHG Emissions From Electronics Manufacturing | | MEMS (micro-electromechanical systems) | | | | 1.86 | kg/m2 | 2019 Refinement | |
| 234189 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.73 | fraction | 2019 Refinement | |
| 234190 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.55 | fraction | 2019 Refinement | |
| 234191 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.4 | fraction | 2019 Refinement | |
| 234192 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | C3F8 Remote | 0.063 | fraction | 2019 Refinement | |
| 234193 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.15 | fraction | 2019 Refinement | |
| 234194 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.13 | fraction | 2019 Refinement | |
| 234195 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.14 | fraction | 2019 Refinement | |
| 234196 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.086 | fraction | 2019 Refinement | |
| 234197 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.46 | fraction | 2019 Refinement | |
| 234198 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.2 | fraction | 2019 Refinement | |
| 234199 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.34 | fraction | 2019 Refinement | |
| 234200 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.064 | fraction | 2019 Refinement | |
| 234201 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | NF3 Remote | 0.02 | fraction | 2019 Refinement | |
| 234202 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.18 | fraction | 2019 Refinement | |
| 234203 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | | 0.55 | fraction | 2019 Refinement | |
| 234204 | - 2E1 - By-product Emissions
| - 2.E.4_R - Microelectromechanical systems (MEMS) – 2019 Refinement
- 2.E.1 - Integrated Circuit or Semiconductor
| | 2019 Refinement default | Tier 2a – Default EFs (Fractions) For GHG Emissions From Semiconductor Manufacturing And From MEMS Manufacturing Under Certain Conditions | | (1-Ui) | | | N2O TFD | 0.78 | fraction | 2019 Refinement | |
